Foam-adhesive bonding is very common in the mechanic and electronic industries. In this paper a metallic strip, frequently found in the computer industry, is analyzed by bonding it to a rigid support by means of a very thin foam-adhesive tape. The bonded strip is clamped to the support with the additional use of three screws and tightened with diverse torques and sequencing. The amount of the strip's warping caused by the screws is measured by using the reflection Moirè technique. Theoretical and numerical analyses are also attempted with the results being in excellent agreement with the experimental data. It is possible to use these results to designate a suitable tightening sequence which reduces warping of the strip.
Numerical and experimental analysis in mechanical connections by means of a foam adhesive bonding / Trentadue, Bartolomeo. - CD-ROM. - (2000). (Intervento presentato al convegno European Congress on Computational Methods in Applied Sciences and Engineering ECCOMAS 2000 tenutosi a Barcelona, Spain nel September 11-14 , 2000).
Numerical and experimental analysis in mechanical connections by means of a foam adhesive bonding
Bartolomeo Trentadue
2000-01-01
Abstract
Foam-adhesive bonding is very common in the mechanic and electronic industries. In this paper a metallic strip, frequently found in the computer industry, is analyzed by bonding it to a rigid support by means of a very thin foam-adhesive tape. The bonded strip is clamped to the support with the additional use of three screws and tightened with diverse torques and sequencing. The amount of the strip's warping caused by the screws is measured by using the reflection Moirè technique. Theoretical and numerical analyses are also attempted with the results being in excellent agreement with the experimental data. It is possible to use these results to designate a suitable tightening sequence which reduces warping of the strip.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
