Hole drilling is the most widespread method for measuring residual stress. It is based on the principle that drilling a hole in the material causes a local stress relaxation; the initial residual stress can be calculated bymeasuring strain in correspondence with each drill depth. Recently optical techniques were introduced to measure strain; in this case, the accuracy of the final results depends, among other factors, on the proper choice of the area of analysis. Deformations are in fact analyzed within an annulus determined by two parameters: the internal and the external radius. In this paper, the influence of the choice of the area of analysis was analysed. A known stress field was introduced on a Ti grade 5 sample and then the stress was measured in correspondence with different values of the internal and the external radius of analysis; results were finally compared with the expected theoretical value.

Remarks on Residual Stress Measurement by Hole-drilling and Electronic Speckle Pattern Interferometry / Barile, Claudia; Casavola, Caterina; Pappalettera, Giovanni; Pappalettere, Carmine. - In: THE SCIENTIFIC WORLD JOURNAL. - ISSN 2356-6140. - 2014:(2014). [10.1155/2014/487149]

Remarks on Residual Stress Measurement by Hole-drilling and Electronic Speckle Pattern Interferometry

BARILE, Claudia;CASAVOLA, Caterina;PAPPALETTERA, Giovanni;PAPPALETTERE, Carmine
2014-01-01

Abstract

Hole drilling is the most widespread method for measuring residual stress. It is based on the principle that drilling a hole in the material causes a local stress relaxation; the initial residual stress can be calculated bymeasuring strain in correspondence with each drill depth. Recently optical techniques were introduced to measure strain; in this case, the accuracy of the final results depends, among other factors, on the proper choice of the area of analysis. Deformations are in fact analyzed within an annulus determined by two parameters: the internal and the external radius. In this paper, the influence of the choice of the area of analysis was analysed. A known stress field was introduced on a Ti grade 5 sample and then the stress was measured in correspondence with different values of the internal and the external radius of analysis; results were finally compared with the expected theoretical value.
2014
Remarks on Residual Stress Measurement by Hole-drilling and Electronic Speckle Pattern Interferometry / Barile, Claudia; Casavola, Caterina; Pappalettera, Giovanni; Pappalettere, Carmine. - In: THE SCIENTIFIC WORLD JOURNAL. - ISSN 2356-6140. - 2014:(2014). [10.1155/2014/487149]
File in questo prodotto:
File Dimensione Formato  
The Scientific World Journal 2014.pdf

accesso aperto

Tipologia: Versione editoriale
Licenza: Creative commons
Dimensione 8.53 MB
Formato Adobe PDF
8.53 MB Adobe PDF Visualizza/Apri

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11589/869
Citazioni
  • Scopus 19
  • ???jsp.display-item.citation.isi??? 15
social impact