Feasibility Investigation of Low Cost Substrate Integrated Waveguide (SIW) Directional Couplers

In this paper, the feasibility of Substrate Integrated Waveguide (SIW) couplers, fabricated using single-layer TACONIC RF-35 dielectric substrate is investigated. The couplers have been produced employing a standard PCB process. The choice of the TACONIC RF-35 substrate as alternative to other conventional materials is motivated by its lower cost and high dielectric constant, allowing the reduction of the device size. The coupler requirements are 90-degree phase shift between the output and the coupled ports and frequency bandwidth from about 10.5 GHz to 12.5 GHz. The design and optimization of the couplers have been performed by using the software CST Microwave Studio°c . Eight di®erent coupler con¯gurations have been designed and compared. The better three couplers have been fabricated and characterized. The proposed SIW directional couplers could be integrated within more complex planar circuits or utilized as stand-alone devices, because of their compact size. They exhibit good performance and could be employed in communication applications as broadcast signal distribution and as key elements for the construction of other microwave devices and systems.