Substrate coupling is a phenomenon that affects the behavior and performance of RF and mixed signal ICs. Prediction of such crosstalk during the design process can help designers. In this paper, a new methodology is presented for performing a fast and reliable characterization of the noise transmission path, modeling the substrate as a resistive network. Adopting only DC measurement techniques, the dependence of disturbances attenuation on the geometric parameters is found. Moreover, the relation between attenuation and disturbance types is indicated. Finally, a qualitative comparison is made between the efficiency of the most commonly used technology measures against substrate crosstalk.
|Titolo:||Evaluation of Technology Options for Substrate noise reduction|
|Data di pubblicazione:||2005|
|Digital Object Identifier (DOI):||http://dx.doi.org/10.1142/S0218126605002167|
|Appare nelle tipologie:||1.1 Articolo in rivista|