Electronic Interferometric Holography is applied to the measurement of interfacial strains between particles and matrix. An integral definition of the quantity adherence is utilized to quantify the interfacial strains. A number of samples are studied and an adherence curve is obtained as a statistical trend of the data. An independent procedure to measure adherence using the stress strain curves of the material is introduced. The adherence curves obtained separately show very good agreement.
Study of Adhesion in a Reinforced Particle Composite / Sciammarella, C. A.; Trentadue, B.; Sciammarella, F. M. (KEY ENGINEERING MATERIALS). - In: Experimental techniques and design in composite materials 5 : proceedings of the Fifth Seminar on Experimental Techniques and Design in Composite Materials / [a cura di] Pierluigi Priolo. - STAMPA. - Uetikon-Zuerich, CH : Trans Tech, 2002. - ISBN 0-87849-891-5. - pp. 315-323 [10.4028/www.scientific.net/KEM.221-222.315]
Study of Adhesion in a Reinforced Particle Composite
B. Trentadue;
2002-01-01
Abstract
Electronic Interferometric Holography is applied to the measurement of interfacial strains between particles and matrix. An integral definition of the quantity adherence is utilized to quantify the interfacial strains. A number of samples are studied and an adherence curve is obtained as a statistical trend of the data. An independent procedure to measure adherence using the stress strain curves of the material is introduced. The adherence curves obtained separately show very good agreement.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
