Adhesively bonded joints represent an interesting alternative to mechanical joints due to the advantages over conventional mechanical fasteners: continuity of the structure, high strength-to-weight ratio, design flexibility. The aim of this work is to assess and predict the quality of aeronautical adhesive bonded CFRP T-joints made by the automated fibre placement process by means of the Thermoelastic Stress analysis (TSA) technique used as non-destructive technique. The results provided by TSA technique, in terms of debonded area, were compared to the well-established lock-in thermography technique showing the capability of TSA to evaluate the quality of T-joints. The approach allows to perform a cost-efficient characterisation process by means of non-destructive evaluations.

Assessment of the quality of adhesive bond in t-joints coupons by using thermoelastic stress analysis / De Finis, Rosa; Palumbo, Davide; Galietti, Umberto. - ELETTRONICO. - 11409:(2020), p. 15. [10.1117/12.2558607]

Assessment of the quality of adhesive bond in t-joints coupons by using thermoelastic stress analysis

De Finis, Rosa;Palumbo, Davide;Galietti, Umberto
2020-01-01

Abstract

Adhesively bonded joints represent an interesting alternative to mechanical joints due to the advantages over conventional mechanical fasteners: continuity of the structure, high strength-to-weight ratio, design flexibility. The aim of this work is to assess and predict the quality of aeronautical adhesive bonded CFRP T-joints made by the automated fibre placement process by means of the Thermoelastic Stress analysis (TSA) technique used as non-destructive technique. The results provided by TSA technique, in terms of debonded area, were compared to the well-established lock-in thermography technique showing the capability of TSA to evaluate the quality of T-joints. The approach allows to perform a cost-efficient characterisation process by means of non-destructive evaluations.
2020
Thermosense: Thermal Infrared Applications XLII
SPIE
Assessment of the quality of adhesive bond in t-joints coupons by using thermoelastic stress analysis / De Finis, Rosa; Palumbo, Davide; Galietti, Umberto. - ELETTRONICO. - 11409:(2020), p. 15. [10.1117/12.2558607]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11589/197785
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