Experimental investigation of thermo-mechanical behaviour of electronic components may help to prevent catastrophic in-service failures. This communication illustrates the use of Electronic Speckle Pattern Interferometry (ESPI) for monitoring the evolution of thermal deformation of electronic components for aerospace applications subject to normal or anomalous working conditions.

ESPI Thermo-mechanical characterization of electronics components under static and cyclic electrical load

CASAVOLA, Caterina;LAMBERTI, Luciano;MORAMARCO, Vincenzo;PAPPALETTERA, Giovanni;PAPPALETTERE, Carmine
2012

Abstract

Experimental investigation of thermo-mechanical behaviour of electronic components may help to prevent catastrophic in-service failures. This communication illustrates the use of Electronic Speckle Pattern Interferometry (ESPI) for monitoring the evolution of thermal deformation of electronic components for aerospace applications subject to normal or anomalous working conditions.
ISEM 2012 - 2nd International Symposium on Experimental Mechanics
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11589/22700
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