Experimental investigation of thermo-mechanical behaviour of electronic components may help to prevent catastrophic in-service failures. This communication illustrates the use of Electronic Speckle Pattern Interferometry (ESPI) for monitoring the evolution of thermal deformation of electronic components for aerospace applications subject to normal or anomalous working conditions.
ESPI Thermo-mechanical characterization of electronics components under static and cyclic electrical load / Casavola, Caterina; Lamberti, Luciano; Moramarco, Vincenzo; Pappalettera, Giovanni; Pappalettere, Carmine. - (2012). (Intervento presentato al convegno ISEM 2012 - 2nd International Symposium on Experimental Mechanics tenutosi a Taipei nel 8-11 November 2012).
ESPI Thermo-mechanical characterization of electronics components under static and cyclic electrical load
CASAVOLA, Caterina;LAMBERTI, Luciano;MORAMARCO, Vincenzo;PAPPALETTERA, Giovanni;PAPPALETTERE, Carmine
2012-01-01
Abstract
Experimental investigation of thermo-mechanical behaviour of electronic components may help to prevent catastrophic in-service failures. This communication illustrates the use of Electronic Speckle Pattern Interferometry (ESPI) for monitoring the evolution of thermal deformation of electronic components for aerospace applications subject to normal or anomalous working conditions.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
