Automated design of integrated inductive components for {DC}-{DC} converters

A higher level of structural and functional integration of semiconductor devices, passive components, sensing, thermal management and control is considered fundamental to unlock wide band gap (WBG) devices full potential and ensure their reliable and cost-effective operation. Establishing design procedures that take into account multi-physics interactions between heterogeneous power electronics components is crucial to fully exploit new materials and advanced packaging technologies. This paper presents an analytical losses model of a magnetically coupled interleaved (MCI) H-bridge for both active devices and inductive components. This model is then used within an optimisation routine to find the best combinations of inductors geometry and software parameters (e.g. switching frequency, dead time, phase shift between H-bridge legs) to minimise the overall losses.