Photonic Integrated Circuits (PIC) provide a solution to overcome the main limitations of electronics, such as the operating frequency and heat generation, pushing the so-called "More than Moore" concept to increase the capacity and the speed of data transmission. In large data centers and optical transmission systems, PICs are interconnected by using fiber-to-chip couplers, which are crucial to improve system performance. An ultra-low loss interconnection (< 1 dB) over a wide bandwidth (approximate to 50 nm) is the gold standard. In this context, the silicon nitride (Si3N4) platform is a promising candidate, with propagation losses of the order of dB/m at 1550 nm. Here, we propose the design and the experimental results for a silicon nitride-based fiber-to-chip interconnect, acting as a high aspect ratio waveguide Spot-Size Converter (SSC). A coupling loss less than 0.20 dB over the entire C-band and within a footprint of 1,800 mu m(2) has been experimentally demonstrated, suggesting the proposed interconnect as a promising solution for next-generation high-density PICs.
Silicon Nitride Spot Size Converter With Very Low-Loss Over the C-Band / Brunetti, G.; Heuvink, R.; Schreuder, E.; Armenise, M. N.; Ciminelli, C.. - In: IEEE PHOTONICS TECHNOLOGY LETTERS. - ISSN 1041-1135. - STAMPA. - 35:22(2023), pp. 1215-1218. [10.1109/lpt.2023.3311914]
Silicon Nitride Spot Size Converter With Very Low-Loss Over the C-Band
Brunetti, G.;Armenise, M. N.;Ciminelli, C.
2023-01-01
Abstract
Photonic Integrated Circuits (PIC) provide a solution to overcome the main limitations of electronics, such as the operating frequency and heat generation, pushing the so-called "More than Moore" concept to increase the capacity and the speed of data transmission. In large data centers and optical transmission systems, PICs are interconnected by using fiber-to-chip couplers, which are crucial to improve system performance. An ultra-low loss interconnection (< 1 dB) over a wide bandwidth (approximate to 50 nm) is the gold standard. In this context, the silicon nitride (Si3N4) platform is a promising candidate, with propagation losses of the order of dB/m at 1550 nm. Here, we propose the design and the experimental results for a silicon nitride-based fiber-to-chip interconnect, acting as a high aspect ratio waveguide Spot-Size Converter (SSC). A coupling loss less than 0.20 dB over the entire C-band and within a footprint of 1,800 mu m(2) has been experimentally demonstrated, suggesting the proposed interconnect as a promising solution for next-generation high-density PICs.File | Dimensione | Formato | |
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