In this work, Printed Circuit Board technology is considered for the design and fabrication of a multilayer air-filled Substrate Integrated Waveguide array antenna in V-band. Different alternative stack-ups are investigated for lamination considering prepreg materials or assembling with dielectric screws. Performances are compared via simulation in terms of bandwidth, maximum gain, total losses, and easiness of construction. The prototype for the stack-up assembled with dielectric screws is chosen for fabrication for easiness.
Feasibility Investigation on a Low-Cost Air-Filled Substrate Integrated Waveguide Array Antenna in V-Band / Loconsole, A. M.; Mahmoud, A.; Anelli, F.; Francione, V. V.; Ettorre, M.; Prudenzano, F.. - (2024), pp. 1-5. (Intervento presentato al convegno 18th European Conference on Antennas and Propagation, EuCAP 2024 tenutosi a Glasgow, UK nel 2024) [10.23919/EuCAP60739.2024.10501173].
Feasibility Investigation on a Low-Cost Air-Filled Substrate Integrated Waveguide Array Antenna in V-Band
Loconsole A. M.;Anelli F.;Francione V. V.;Prudenzano F.
2024-01-01
Abstract
In this work, Printed Circuit Board technology is considered for the design and fabrication of a multilayer air-filled Substrate Integrated Waveguide array antenna in V-band. Different alternative stack-ups are investigated for lamination considering prepreg materials or assembling with dielectric screws. Performances are compared via simulation in terms of bandwidth, maximum gain, total losses, and easiness of construction. The prototype for the stack-up assembled with dielectric screws is chosen for fabrication for easiness.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
