In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.
|Titolo:||Optimized Electrothermal Design of Integrated Devices through the solution to the Non-linear 3-D Heat Flow Equation|
|Data di pubblicazione:||2001|
|Digital Object Identifier (DOI):||10.1016/S0026-2692(01)00069-6|
|Appare nelle tipologie:||1.1 Articolo in rivista|