In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.
Optimized Electrothermal Design of Integrated Devices through the solution to the Non-linear 3-D Heat Flow Equation / Pesare, M.; Giorgio, A.; Perri, A. G.. - In: MICROELECTRONICS JOURNAL. - ISSN 0959-8324. - STAMPA. - 32:10-11(2001), pp. 823-831. [10.1016/S0026-2692(01)00069-6]
Optimized Electrothermal Design of Integrated Devices through the solution to the Non-linear 3-D Heat Flow Equation
Giorgio, A.;Perri, A. G.
2001-01-01
Abstract
In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
