In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.

Optimized Electrothermal Design of Integrated Devices through the solution to the Non-linear 3-D Heat Flow Equation

Giorgio, A.;Perri, A. G.
2001

Abstract

In this paper, an optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat equation is presented. The thermal solution has been achieved by the Kirchhoff transform and the 2-D Fourier transform. The electrothermal feedback has been implemented by calculating the device current at the actual channel temperature. A multiple layer structure approximating the effect of the package has been considered as spatial domain in which the heat equation has been solved.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11589/10497
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