Optical Wireless Networks on-Chip have been recently proposed as alternative paradigm to overcome the communication bottleneck in computing architectures based on electrical networks. In this paper, we propose the design of a 3×3 switching matrix for optical wireless on-chip interconnection. The design exploits integrated optical phased arrays to guarantee the communication among three transmitters and three receivers. In this work, the effect of multipath propagation in the on-chip multi-layer structure is taken into account, and the impact of the cladding layer thickness is evaluated. The proposed device is intended to interconnect multiple nodes assuring reconfigurability and high bandwidth.

Reconfigurable Optical Wireless Switches for on-chip Interconnection

Calo Giovanna;Gabriele L.;Petruzzelli Vincenzo
2022-01-01

Abstract

Optical Wireless Networks on-Chip have been recently proposed as alternative paradigm to overcome the communication bottleneck in computing architectures based on electrical networks. In this paper, we propose the design of a 3×3 switching matrix for optical wireless on-chip interconnection. The design exploits integrated optical phased arrays to guarantee the communication among three transmitters and three receivers. In this work, the effect of multipath propagation in the on-chip multi-layer structure is taken into account, and the impact of the cladding layer thickness is evaluated. The proposed device is intended to interconnect multiple nodes assuring reconfigurability and high bandwidth.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11589/247001
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