Next Generation of 3D‐Printed Electronics: Electroplating Inside Channels to Embed 3D Copper Features within Polymeric Structures Fabricated Through Material Extrusion / Stano, Gianni; D'Orazio, Mattia; Pavone, Antonio; Percoco, Gianluca. - In: ADVANCED MATERIALS TECHNOLOGIES. - ISSN 2365-709X. - (2024). [10.1002/admt.202401923]

Next Generation of 3D‐Printed Electronics: Electroplating Inside Channels to Embed 3D Copper Features within Polymeric Structures Fabricated Through Material Extrusion

Stano, Gianni
;
D'Orazio, Mattia;Percoco, Gianluca
2024-01-01

2024
Next Generation of 3D‐Printed Electronics: Electroplating Inside Channels to Embed 3D Copper Features within Polymeric Structures Fabricated Through Material Extrusion / Stano, Gianni; D'Orazio, Mattia; Pavone, Antonio; Percoco, Gianluca. - In: ADVANCED MATERIALS TECHNOLOGIES. - ISSN 2365-709X. - (2024). [10.1002/admt.202401923]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11589/280911
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